发表论文40余篇，获授权专利超100件。
代表性论文：
1. Hongfei Tao, Yuanhang Liu, Dewen Zhao, Xinchun Lu, Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process, TRIBOLOGY INTERNATIONAL, 2023, 189.
2. Hongfe Tao, Yuanhang Liu, Dewen Zhao, Xinchun Lu, Undeformed chip width non-uniformity modeling and surface roughness prediction in wafer self-rotational grinding process, TRIBOLOGY INTERNATIONAL, 2022, 171.
3. Qinyang Zeng, Changkun Li, Dewen Zhao, Xinchun Lu, Atomic-scale study on particle movement mechanism during silicon substrate cleaning using ReaxFF MD, COMPUTATIONAL MATERIALS SCIENCE, 2022, 214.
4. Hongfei Tao, Yuanhang Liu, Dewen Zhao, Xinchun Lu, The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers, INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2022, 222.
5. Yuanhang Liu, Hongfei Tao, Dewen Zhao, Xinchun Lu, An Investigation on the Total Thickness Variation Control and Optimization in the Wafer Backside Grinding Process, MATERIALS, 2022, 15(12).
6. Changkun Li, Dewen Zhao, Jialin Wen, Xinchun Lu, Numerical investigation of wafer drying induced by the thermal Marangoni effect, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2019, 132: 689-698.
7. Changkun Li, Dewen Zhao, Jialin Wen, Jie Cheng, Xinchun Lu, Evolution of entrained water film thickness and dynamics of Marangoni flow in Marangoni drying, RSC ADVANCES, 2018, 8(9): 4995-5004.
8. Dewen Zhao, Yongyong He, Tongqing Wang, Xinchun Lu, Comparative study of the lubricating behavior between 12-in. copper disk and wafer during chemical mechanical polishing, TRIBOLOGY INTERNATIONAL, 2017, 739: 75-80.
9. Dewen Zhao, Xinchun Lu, Chemical mechanical polishing: Theory and experiment, FRICTION, 2013, 1(4): 306-326.
10. Dewen Zhao, Tongqing Wang, Yongyong He, Xinchun Lu, Kinematic Optimization for Chemical Mechanical Polishing Based On Statistical Analysis of Particle Trajectories, IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURINGSEMICONDUCTOR MANUFACTURING, 2013, 16(4): 556-563.
11. Dewen Zhao, Yongyong He, Tongqing Wang, Xinchun Lu, Jianbin Luo, Wafer bending/orientation characterization and their effects on fluid lubrication during chemical mechanical polishing, TRIBOLOGY INTERNATIONAL, 2013, 66: 330-336.
12. Dewen Zhao, Yongyong He, XinchunLu, In Situ Measurement of Fluid Pressure at the Wafer-Pad Interface during Chemical Mechanical Polishing of 12-inch Wafer, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2012, 159(1): H22-H28.
